无流底填料用非酸酐固化体系的研究

2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220) Pub Date : 2001-05-29 DOI:10.1109/ECTC.2001.928031

Zhuqing Zhang, L. Fan, C. Wong

{"title":"无流底填料用非酸酐固化体系的研究","authors":"Zhuqing Zhang, L. Fan, C. Wong","doi":"10.1109/ECTC.2001.928031","DOIUrl":null,"url":null,"abstract":"Most no-flow underfill materials are based on epoxy/anhydride chemistry. Due to the its sensitizing nature, the use of anhydride is limited and there is a need for a no-flow underfill using non-anhydride curing system. This paper presents the development of novel no-flow underfill materials based on epoxy/phenolic resin system. Epoxy and phenolic resins of different structures are evaluated in term of their curing behavior, thermo-mechanical properties and the reliability. Compared with anhydride cured epoxy resins, epoxy/phenolic resins show high adhesion, high fracture toughness, low crosslinking density and high viscosity. The assembly with non-anhydride underfill shows high reliability during the thermal shock test. Using proper fluxing agent, no-flow underfills based on epoxy/phenolic system have been developed.","PeriodicalId":340217,"journal":{"name":"2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)","volume":"91 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-05-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Study of non-anhydride curing system for no-flow underfill applications\",\"authors\":\"Zhuqing Zhang, L. Fan, C. Wong\",\"doi\":\"10.1109/ECTC.2001.928031\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Most no-flow underfill materials are based on epoxy/anhydride chemistry. Due to the its sensitizing nature, the use of anhydride is limited and there is a need for a no-flow underfill using non-anhydride curing system. This paper presents the development of novel no-flow underfill materials based on epoxy/phenolic resin system. Epoxy and phenolic resins of different structures are evaluated in term of their curing behavior, thermo-mechanical properties and the reliability. Compared with anhydride cured epoxy resins, epoxy/phenolic resins show high adhesion, high fracture toughness, low crosslinking density and high viscosity. The assembly with non-anhydride underfill shows high reliability during the thermal shock test. Using proper fluxing agent, no-flow underfills based on epoxy/phenolic system have been developed.\",\"PeriodicalId\":340217,\"journal\":{\"name\":\"2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)\",\"volume\":\"91 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2001-05-29\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ECTC.2001.928031\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ECTC.2001.928031","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

大多数无流底填料是基于环氧/酸酐化学。由于酸酐的增敏性，酸酐的使用受到限制，因此需要使用非酸酐固化体系的无流底填料。介绍了基于环氧/酚醛树脂体系的新型无流底填料的研制。对不同结构的环氧树脂和酚醛树脂的固化性能、热机械性能和可靠性进行了评价。与酸酐固化的环氧树脂相比，环氧/酚醛树脂具有高附着力、高断裂韧性、低交联密度和高粘度的特点。在热冲击试验中，无酸酐底填料的组合具有较高的可靠性。采用合适的助熔剂，研制了环氧/酚醛体系无流底填料。

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Study of non-anhydride curing system for no-flow underfill applications

Most no-flow underfill materials are based on epoxy/anhydride chemistry. Due to the its sensitizing nature, the use of anhydride is limited and there is a need for a no-flow underfill using non-anhydride curing system. This paper presents the development of novel no-flow underfill materials based on epoxy/phenolic resin system. Epoxy and phenolic resins of different structures are evaluated in term of their curing behavior, thermo-mechanical properties and the reliability. Compared with anhydride cured epoxy resins, epoxy/phenolic resins show high adhesion, high fracture toughness, low crosslinking density and high viscosity. The assembly with non-anhydride underfill shows high reliability during the thermal shock test. Using proper fluxing agent, no-flow underfills based on epoxy/phenolic system have been developed.

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2001 Proceedings. 51st Electronic Components and Technology Conference (Cat. No.01CH37220)

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