{"title":"三维包装方法的调查和分类","authors":"J. Lyke, K. Merkel","doi":"10.1109/DASC.1996.559147","DOIUrl":null,"url":null,"abstract":"This paper presents a survey of the field of 3-D packaging and suggests a taxonomy based on observations of an active research field and direct experience in the development of dimensionally-constrained electronics system packaging concepts. Of chief interest is the (1) identification of the attributes of 3-D approaches and quantitative performance metrics; (2) packaging medium and facilitation (e.g. thermal, mechanical, and electrical access) requirements; and the manifestation of certain regimes in 3-D packaging (e.g., \"few-layers\" vs. \"many-layers\"). The development of the taxonomy is further motivated by the discussion of 3-D heterogeneous packaging approaches as an ideal framework for packaging and interconnecting complex mixtures of analog, digital, sensor, microwave, and power management functional elements.","PeriodicalId":332554,"journal":{"name":"15th DASC. AIAA/IEEE Digital Avionics Systems Conference","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"1996-10-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Survey and taxonomy of three-dimensional packaging approaches\",\"authors\":\"J. Lyke, K. Merkel\",\"doi\":\"10.1109/DASC.1996.559147\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper presents a survey of the field of 3-D packaging and suggests a taxonomy based on observations of an active research field and direct experience in the development of dimensionally-constrained electronics system packaging concepts. Of chief interest is the (1) identification of the attributes of 3-D approaches and quantitative performance metrics; (2) packaging medium and facilitation (e.g. thermal, mechanical, and electrical access) requirements; and the manifestation of certain regimes in 3-D packaging (e.g., \\\"few-layers\\\" vs. \\\"many-layers\\\"). The development of the taxonomy is further motivated by the discussion of 3-D heterogeneous packaging approaches as an ideal framework for packaging and interconnecting complex mixtures of analog, digital, sensor, microwave, and power management functional elements.\",\"PeriodicalId\":332554,\"journal\":{\"name\":\"15th DASC. AIAA/IEEE Digital Avionics Systems Conference\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-10-27\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"15th DASC. AIAA/IEEE Digital Avionics Systems Conference\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/DASC.1996.559147\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"15th DASC. AIAA/IEEE Digital Avionics Systems Conference","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/DASC.1996.559147","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Survey and taxonomy of three-dimensional packaging approaches
This paper presents a survey of the field of 3-D packaging and suggests a taxonomy based on observations of an active research field and direct experience in the development of dimensionally-constrained electronics system packaging concepts. Of chief interest is the (1) identification of the attributes of 3-D approaches and quantitative performance metrics; (2) packaging medium and facilitation (e.g. thermal, mechanical, and electrical access) requirements; and the manifestation of certain regimes in 3-D packaging (e.g., "few-layers" vs. "many-layers"). The development of the taxonomy is further motivated by the discussion of 3-D heterogeneous packaging approaches as an ideal framework for packaging and interconnecting complex mixtures of analog, digital, sensor, microwave, and power management functional elements.