深亚微米互连中的抖动

Jinwook Jang, Sheng Xu, W. Burleson
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引用次数: 11

摘要

长片上互连中的时序抖动已成为影响信号完整性和时序违规的一个日益重要的问题。本文主要研究70nm CMOS中点对点和支路RC和RLC互连中中继器电源噪声引起的周对周抖动。我们建立了一个基于传播延迟变化的抖动解析表达式,可以准确地预测HSPICE仿真结果。我们展示了RC和RLC导线模型对抖动的影响差异(高达64%)。我们还提出了一种与传统延迟最优插入方法不同的抖动最优中继器插入方法,该方法可以实现更大的中继器。最后,我们介绍了通过调整中继器大小和调整电源噪声相位来减少支路全局互连中时序违规的方法。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Jitter in deep sub-micron interconnect
Timing jitter in long on-chip interconnects has become an increasingly important issue in signal integrity and timing violations. In this paper, we focus on cycle-to-cycle jitter induced by repeater power supply noise in both point-to-point and branched RC and RLC interconnects in 70nm CMOS. We develop an analytical expression for jitter based on propagation delay variation that accurately predicts HSPICE simulation results. We show the difference in impact between RC and RLC wire models on jitter (up to 64%). We also show a method for jitter-optimal repeater insertion which differs from conventional delay optimal insertion methods, resulting in larger repeaters. Finally, we introduce methods which can decrease timing violations in branched global interconnects by adjusting repeater size and tuning the phase of the power supply noise.
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