利用高交联环氧树脂的计算机断层扫描进行有限元分析时产生的实际微观结构空洞

A. Elruby, Stephen M. Handrigan, S. Nakhla
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引用次数: 0

摘要

复合材料广泛应用于汽车、航空航天、船舶等工程领域。复合材料的力学性能优于传统金属的强度/刚度-重量比。然而,复合材料,特别是纤维增强聚合物(FRP)通常会遭受复杂的破坏模式。其中两种以树脂材料为主。在目前的工作中,计算机断层扫描(CT)被用来表征类似于航空航天应用中使用的普通环氧树脂中的微观结构空隙含量。在主流有限元(FE)软件Abaqus中开发并实现了Python脚本,利用计算机断层扫描(CT)对高交联环氧树脂进行扫描,生成实际的微观结构有限元模型。开发的脚本可以建模复杂的微观结构特征,例如基于其实际物理方面(即大小/位置)的微空洞。采用包含微观结构区域的试样尺寸模型来研究材料在微尺度长度下的行为和损伤引发。采用扩展有限元法(XFEM)的框架,研究了微结构空洞对损伤过程的影响。该算法能够在中等规模的台式计算机上在不到1分钟的运行时间内生成微力学模型。与目前研究的实验数据相比,预测结果证明了极好的一致性。观察到微观结构的空洞起到了应力产生的作用,并在微长度处触发损伤过程,并可能导致最终断裂。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Actual Microstructural Voids Generation In Finite Element Analysis Utilizing Computed Tomography Scan Of Highly Cross-Linked Epoxy
Composite materials are widely used in several engineering fields such as automotive, aerospace and ship industries. The mechanical behavior of composites is superior to that of conventional metals regarding strength/stiffness-to-weight ratios. However, composite materials and especially fiber-reinforced polymers (FRP) usually suffer from complex failure modes. Two of which are dominated by the resin material. In the present work, computed tomography (CT) was utilized to characterize the microstructural voids content in a plain epoxy resin similar to the one used in aerospace applications. A Python script was developed and implemented within the mainstream finite element (FE) software Abaqus to generate actual microstructural FE model employing computed tomography (CT) scan of highly cross-linked epoxy. The developed script enabled modeling sophisticated microstructural features such as micro-voids based on their actual physical aspects, i.e., size/location. Specimen sized models incorporating microstructural region(s) were used to investigate the material behavior and damage initiation at microscale lengths. The framework of extended finite element method (XFEM) was utilized to investigate the effect of microstructural voids on the damage process. The proposed algorithm is capable of generating a micromechanical model in less than one-minute runtime using moderate desktop computer. Prediction results proved excellent agreement compared to experimental data from the current investigation. Microstructural voids were observed to act as stress raisers and to trigger the damage process at micro-lengths and possibly leading to the final fracture.
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