基于ASIC技术的氢化非晶硅薄膜传感器

M. Despeisse, D. Moraes, G. Anelli, P. Jarron, J. Kapłon, R. Rusack, S. Saramad, N. Wyrsch
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引用次数: 7

摘要

研究了一种基于在加工集成电路上沉积薄膜传感器的新型探测器技术的性能和局限性。氢化非晶硅(a-Si:H)薄膜沉积在为这些研究开发的CMOS电路上,并提出了由此产生的“ASIC上的薄膜”(TFA)探测器。高反向偏置下a- si:H传感器的漏电流是限制TFA检测器性能的一个重要参数。对其进行了详细的研究,并对探测器进行了像素分割。高内部电场(10/sup 4/-10/sup 5/ V/cm)可以在a-Si:H传感器中建立,并克服了a-Si:H中电子和空穴的低迁移率。利用660nm脉冲激光在集成5ns峰值时间前置放大器的ASIC TFA探测器上研究了a- si:H传感器中产生的载流子运动和速度对信号的感应。测量装置还允许研究传感器的损耗,并给出了结果。最后,展示了基于集成低噪声前置放大器(27 e/sup -/ r.m.s)的ASIC的TFA探测器对5.9 keV x射线的直接探测。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Hydrogenated amorphous silicon sensors based on thin film on ASIC technology
The performance and limitations of a novel detector technology based on the deposition of a thin-film sensor on top of processed integrated circuits have been studied. Hydrogenated amorphous silicon (a-Si:H) films have been deposited on top of CMOS circuits developed for these studies and the resulting "thin-film on ASIC" (TFA) detectors are presented. The leakage current of the a-Si:H sensor at high reverse biases turns out to be an important parameter limiting the performance of a TFA detector. Its detailed study and the pixel segmentation of the detector are presented. High internal electric fields (in the order of 10/sup 4/-10/sup 5/ V/cm) can be built in the a-Si:H sensor and overcome the low mobility of electrons and holes in a-Si:H. Signal induction by generated carrier motion and speed in the a-Si:H sensor have been studied with a 660 nm pulsed laser on a TFA detector based on an ASIC integrating 5 ns peaking time pre-amplifiers. The measurement set-up also permits to study the depletion of the sensor and results are presented. Finally, direct detection of 5.9 keV X-rays with TFA detectors based on an ASIC integrating low noise pre-amplifiers (27 e/sup -/ r.m.s.) are shown.
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