{"title":"集成平面光互连封装中的对准性与信号密度","authors":"A. K. Ghosh, R. Beech","doi":"10.1364/odp.1993.wa.13","DOIUrl":null,"url":null,"abstract":"Free space optical interconnects are well suited to complex, 3-D interconnect patterns and high density parallel interconnections because of their low cross-talk and the ability of beams to pass through one another with minimal interference [1].","PeriodicalId":296845,"journal":{"name":"Optical Design for Photonics","volume":"130 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Alignability Versus Signal Density in Integrated Planar-Optical Interconnect Packages\",\"authors\":\"A. K. Ghosh, R. Beech\",\"doi\":\"10.1364/odp.1993.wa.13\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Free space optical interconnects are well suited to complex, 3-D interconnect patterns and high density parallel interconnections because of their low cross-talk and the ability of beams to pass through one another with minimal interference [1].\",\"PeriodicalId\":296845,\"journal\":{\"name\":\"Optical Design for Photonics\",\"volume\":\"130 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1900-01-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Optical Design for Photonics\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1364/odp.1993.wa.13\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Optical Design for Photonics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1364/odp.1993.wa.13","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Alignability Versus Signal Density in Integrated Planar-Optical Interconnect Packages
Free space optical interconnects are well suited to complex, 3-D interconnect patterns and high density parallel interconnections because of their low cross-talk and the ability of beams to pass through one another with minimal interference [1].
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