硅化玻璃微粒作为光树脂填料嵌入电子元件的效果

Tobias Tiedje, K. Nieweglowski, K. Bock
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摘要

本文展示了硅化玻璃颗粒作为光树脂填料在立体平版印刷中嵌入电子元件的效果。介绍了填充光树脂的制备工艺,指出了硅烷化填料和非硅烷化填料在粘度、均匀性和粒径分布等方面的差异。综上所述,微米级硅化填料在平面应用中表现出最好的效果。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Effects of Silanated Glass Particles as Photo Resin Filler to Embed Electronic Components
This paper shows the effects of silanated glass particles as a photo resin filler for the embedding of electronic components using a stereolithographic printing approach. It describes the manufacturing process of the filled photo resins and points out the difference of silanated and non-silanated fillers regarding the viscosity, homogeneity, and particle size distributions. In conclusion, the silanated filler with micrometer scaled particle size distributions shows the best result for the planed application.
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