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引用次数: 0
摘要
球栅阵列(BGA)作为电子设备的互连系统，其可靠性的提高具有重要意义。由于电子器件的紧凑性，采用球栅阵列(BGA)互连方法作为通道在电子器件内部传输功率和信号。然而，BGA的可靠性是非常重要的，因为它对器件的性能有直接的影响。采用球剪试验对焊接球的可靠性和粘接强度进行了评价。为此，本文对球栅阵列(BGA)焊点在不同剪切高度下的剪切试验进行了模拟。采用Ansys version 11进行仿真。比较了Sn-3.9Ag-0.6Cu和Sn-3.5Ag-0.7Cu两种焊球材料的可靠性。模拟结果表明，剪切柱高度对剪切试验结果有显著影响。与Sn-3.9Ag-0.6Cu钎料球相比，Sn-3.5Ag-0.7Cu钎料球表现出更高的应力。
Finite Element Analysis on Sn-3.9Ag-0.6Cu and Sn-3.5Ag-0.7Cu Using Different Shearing Height
Enhancing the reliability Ball grid array (BGA) is significant due major contribution as an interconnection in the electronic devices. Due to the compactness of the electronic devices, ball grid array (BGA) interconnection methods are utilized as passage to transmit power and signals within the electronic. However, the reliability of the BGA is very significant as it has a direct effect on the performance of the device. Ball shear test are utilized to evaluate the reliability and adhesion strength of the solder ball. Therefore, in this work, shear test on solder joint of Ball Grid Array (BGA) was with varied shear height were simulated. Ansys version 11 was utilized for the simulation. The reliability two types of solder ball material, Sn-3.9Ag-0.6Cu and Sn-3.5Ag-0.7Cu were compared. The simulation result showed that shear ram height has significant influence on the outcome of the shear test. The Sn-3.5Ag-0.7Cu solder ball exhibited higher stress when compared Sn-3.9Ag-0.6Cu solder ball.
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