评估电路级热载流子可靠性

1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173) Pub Date : 1900-01-01 DOI:10.1109/RELPHY.1998.670509

W. Jiang, H. Le, J. Chung, T. Kopley, P. Marcoux, C. Dai

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引用次数: 21

摘要

定义了影响电路级热载流子可靠性的主要因素，并对其进行了定性分析。探讨了寿命-低估/标准-过度规范与已知器件/电路信息量之间的内在反比关系。寿命-低估/标准-过度规范被证明非常强烈地依赖于所使用的特定的“最坏情况”近似。

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Assessing circuit-level hot-carrier reliability

The major factors that cumulatively determine circuit-level hot-carrier reliability are defined and characterized in this paper. The inherent inverse relationship between lifetime-underestimation/criteria-overspecification and the amount of known device/circuit information is explored. Lifetime-underestimation/criteria-overspecification is shown to depend quite strongly on the particular "worst-case" approximations used.

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来源期刊

1998 IEEE International Reliability Physics Symposium Proceedings. 36th Annual (Cat. No.98CH36173)

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