e波段孔径耦合GaAs / LCP天线

T. Merkle, S. Smith, N. Nikolic, K. Smart, M. Shen
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引用次数: 1

摘要

提出了一种采用层压多芯片模块(MCM-L)工艺封装的GaAs和液晶聚合物(LCP)衬底组合的e波段孔径耦合贴片天线。该天线在GaAs MMIC和单独的介电天线包之间提供电磁接口。介绍了该天线的设计、制造、封装和测试结果。介绍了一种用于天线测试的波导到微带转换的测量方法,该方法在整个e波段获得了优异的性能。需要对包装方法进行进一步分析,以评估在测量中观察到的不可预测的损失。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
E-band aperture coupled GaAs / LCP antennas
An E-band aperture coupled patch antenna using a combination of GaAs and liquid crystal polymer (LCP) substrates packaged with a laminated multi-chip module (MCM-L) process is presented in this paper. The antenna offers an electromagnetic interface between a GaAs MMIC and a separate dielectric antenna package. Design, manufacture, packaging and test results of the proposed antenna are presented. Measurement of a waveguide to microstrip transition used in the testing of the antenna is presented with excellent performance obtained across the E-band. Further analysis of the packaging method is required to assess the unpredicted loss observed in the measurements.
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