基于表面微加工技术的94 ghz MMIC小型化混合环形耦合器

Won-Young Uhm, Tae-Jong Beak, K. Ryu, Sungchan Kim
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引用次数: 0

摘要

在这项研究中,我们在GaAs衬底上开发了一种减小的94 GHz混合环形耦合器,以证明在毫米波范围内集成各种无源元件和mmic的可能性。为了减小混合式环形耦合器的尺寸,我们在环形结构的内部使用了多个开口桩。与不带开口桩的混合式环形耦合器相比,带多个开口桩的混合式环形耦合器的芯片尺寸减小了62%。在环形结构内部采用多个开口桩后,在损耗、隔离和相位差特性方面的性能没有明显变化。在90 ~ 100 GHz的测量频率范围内,简化后的混合式环形耦合器耦合损耗为3.87±0.33 dB,传输损耗为3.77±0.72 dB。在94 GHz时,隔离度和反射度分别为- 48 dB和- 32 dB。在94 GHz时,两个输出端口之间的相位差为180°±1°。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Reduced Hybrid Ring Coupler Using Surface Micromachining Technology for 94-GHz MMIC Applications
In this study, we developed a reduced 94 GHz hybrid ring coupler on a GaAs substrate in order to demonstrate the possibility of the integration of various passive components and MMICs in the millimeter-wave range. To reduce the size of the hybrid ring coupler, we used multiple open stubs on the inside of the ring structure. The chip size of the reduced hybrid ring coupler with multiple open stubs was decreased by 62% compared with the area of the hybrid ring coupler without open stubs. Performance in terms of the loss, isolation, and phase difference characteristics exhibited no significant change after the use of the multiple open stubs on the inside of the ring structure. The reduced hybrid ring coupler showed excellent coupling loss of 3.87±0.33 dB and transmission loss of 3.77±0.72 dB in the measured frequency range of 90–100 GHz. The isolation and reflection were −48 dB and −32 dB at 94 GHz, respectively. The phase differences between two output ports were 180°±1° at 94 GHz.
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