采用22nm CMOS技术的低功耗6T SRAM单元

Nibha Kumari, Prof. Vandana Niranjan
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引用次数: 0

摘要

静态随机存取存储器(SRAM)由于单个SRAM单元使用大量晶体管,大约占据芯片总面积的90%。因此,SRAM单元成为芯片上的耗电块,从动态和静态的角度来看,它在较低的技术中变得更加突出。静态功耗是由于与关闭的晶体管相关的泄漏电流造成的,动态功耗是由于电路电容的充电和放电造成的。随着栅极长度或沟道长度的减小,栅极氧化物的厚度也随之减小。传统晶体管的微缩会导致电子从栅极向沟道的巨大隧穿,从而导致更高的泄漏功耗。因此,采用金属栅极、高k介电介质和应变si晶体管,在低功耗、性能和可接受的延迟方面表现出更好的效果。在SRAM单元的各种拓扑结构中,6T被认为是低功耗应用的合适选择。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Low-Power 6T SRAM Cell using 22nm CMOS Technology
Static Random-Access Memory (SRAM) occupies approximately 90% of total area on a chip due to high number of transistors used for a single SRAM cell. Therefore, SRAM cell becomes a power-hungry block on a chip and it becomes more prominent at lower technologies from both dynamic and static perspective. Static power consumption is due to leakage current associated with the transistors that are off and dynamic power consumption is due to charging and discharging of the circuit capacitance. As gate length or channel length decreases gate oxide thickness also scales down. Scaling down of conventional transistor results in huge tunneling of electron from gate into channel leading to higher leakage power consumption. So, transistor with metal gate, high-k dielectric and strained-Si is used which shows better result in terms of low-power consumption, better performance with acceptable delay. Among various topologies of SRAM cell 6T is considered as a suitable choice for low power applications.
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