利用等离子体辅助分子束外延生长出工作频率为2 ~ 25 GHz的高功率GaN/AlGaN/GaN hemt

M. Manfra
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引用次数: 0

摘要

本文报道了等离子体辅助分子束外延(MBE)在半绝缘SiC衬底上生长GaN/AlGaN/GaN高电子迁移率晶体管(HEMTs)的生长和功率性能。我们详细介绍了在板材密度为1.2/spl乘以/10/sup / 13/ cm/sup -2/时,持续产生高迁移率二维电子气体(2deg)的MBE生长条件。由这些层制成的晶体管在2ghz时功率密度超过8w /mm,在7ghz时功率密度超过6w /mm,在25ghz时功率密度超过3w /mm。所有的功率数据都是在没有使用SiN表面钝化层的情况下实现的。实现高功率工作的核心是降低射频色散。我们的增长研究主要集中在抑制射频色散和最大化射频输出功率。脉冲IV和门滞后测量用于量化不同异质结构设计中的色散量,并阐明导致门滞后的捕获机制。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
High power GaN/AlGaN/GaN HEMTs operating at 2 to 25 GHz grown by plasma-assisted molecular beam epitaxy
We report on the growth and power performance of GaN/AlGaN/GaN high electron mobility transistors (HEMTs) grown by plasma-assisted molecular beam epitaxy (MBE) on semi-insulating SiC substrates. We detail the MBE growth conditions that consistently produce high mobility two-dimensional electron gases (2DEGs) with room temperature mobility of /spl sim/1400 cm/sup 2//Vs at a sheet density of 1.2/spl times/10/sup 13/ cm/sup -2/. Transistors fabricated from these layers have demonstrated power densities in excess of 8 W/mm at 2 GHz, 6 W/mm at 7 GHz, and 3 W/mm at 25 GHz. All power data is achieved without the use of a SiN surface passivation layer. Central to the achievement of high power operation is the reduction of RF dispersion. Our growth studies have focused on the suppression of RF dispersion and maximizing RF output power. Pulsed IV and gate lag measurements are used to quantify the amount of dispersion in different heterostructure designs and to elucidate the trapping mechanisms responsible for gate lag.
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