全嵌入式板级光互连性能评价

Digest of the LEOS Summer Topical Meetings Biophotonics/Optical Interconnects and VLSI Photonics/WBM Microcavities, 2004. Pub Date : 2004-06-28 DOI:10.1109/LEOSST.2004.1338679

J.I. Choi, Li Wang, Xiaolong Wang, D. Hass, J. Magera, R.T. Chen

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引用次数: 5

摘要

我们已经制作了一种薄的柔性波导薄膜，用于全嵌入式板级光互连。首先，使用标准光刻工艺在硅片上形成主波导结构。两个12通道850 nm VCSEL阵列(2.5 Gb/s和10 Gb/s)和一个PIN光电二极管阵列用作柔性聚合物波导薄膜上的I/O源。减小了VCSEL的初始衬底厚度(200 /spl mu/m)，以方便VCSEL和完全嵌入结构的热管理。

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Performance evaluation of fully embedded board level optical interconnection

We have made a thin flexible waveguide film for fully embedded board level optical interconnections. First, the master waveguide structures are formed on a silicon wafer using a standard photolithography process. Two 12-channel, 850 nm VCSEL arrays (2.5 Gb/s and 10 Gb/s) and a PIN photodiode array are used as I/O sources on a flexible polymeric waveguide film. The initial substrate thickness (200 /spl mu/m) of the VCSEL is reduced to facilitate thermal management of the VCSEL and the fully embedded structure.

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来源期刊

Digest of the LEOS Summer Topical Meetings Biophotonics/Optical Interconnects and VLSI Photonics/WBM Microcavities, 2004.

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