通过改变SOI DG nMOS器件参数优化栅极泄漏的实验

M. Suman, Sandeep Kumar, Brinda Bhowmic
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引用次数: 0

摘要

本文试图通过改变器件参数如Si膜厚度、栅极长度、沟道掺杂、栅极氧化物厚度和埋地氧化物厚度来优化超薄SOI双栅n沟道MOSFET的栅极漏电流。由于关键特征尺寸尺寸在10nm以下的缩小,探索了MOSFET的最终尺寸缩放极限。本文采用非平衡格林函数(NEGF)方法。利用开放边界的二维自洽薛定谔-泊松求解器捕捉载流子输运的量子力学性质。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Experiment to optimize gate leakage by variation in device parameters in SOI DG nMOS
In this paper we try to optimize the Gate leakage current of ultra-thin SOI Double-Gate n-channel MOSFET by varying device parameters such as Si film thickness, Gate length, channel doping, Gate oxide thickness and buried oxide thickness. The ultimate size scaling limits of MOSFET is explored owing to scaling down of critical feature dimension size below 10nm. In this paper, we use a non-equilibrium Green's function (NEGF) approach. The two-dimensional self-consistent Schrodinger-Poisson solver with open boundaries is used to capture the quantum mechanical nature of carrier transport.
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