当今工业中高速电背板的现状和向光互连的过渡

Digest of the LEOS Summer Topical Meetings Biophotonics/Optical Interconnects and VLSI Photonics/WBM Microcavities, 2004. Pub Date : 2004-06-28 DOI:10.1109/LEOSST.2004.1338678

F. Gisin, G. Dudnikov

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引用次数: 3

摘要

本文将介绍高速电背板的现状，包括其性能、扩展前景以及影响其性能的因素。光互连的潜在好处和从电到光迁移的技术挑战也将被涵盖。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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State of the art of electrical high speed backplanes in industry today and the transition to optical interconnects

The current status of high-speed electrical backplanes including their capabilities, prospects for extending them, and factors that impact their performance will be presented. The potential benefits of optical interconnect and the technical challenges in migrating from electrical to optical will also be covered.

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来源期刊

Digest of the LEOS Summer Topical Meetings Biophotonics/Optical Interconnects and VLSI Photonics/WBM Microcavities, 2004.

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