智能电源和集成多芯片电源电路设计的快速热建模

8th International Symposium on Power Semiconductor Devices and ICs. ISPSD '96. Proceedings Pub Date : 1996-05-20 DOI:10.1109/ISPSD.1996.509474

P. Dupuy, J. Dorkel, P. Tounsi, L. Borucki

{"title":"智能电源和集成多芯片电源电路设计的快速热建模","authors":"P. Dupuy, J. Dorkel, P. Tounsi, L. Borucki","doi":"10.1109/ISPSD.1996.509474","DOIUrl":null,"url":null,"abstract":"This paper recalls how the two-port network theory can be introduced to solve the 3D heat flow equation in a multilayered plane structure. In this paper we present two pieces of software based on the application of this theory, which are used to analyze the thermal behavior of SmartMos circuits with a fairly good accuracy and short computational times. Finally, an illustration is given and some comparisons are made with experiments and an FE code.","PeriodicalId":377997,"journal":{"name":"8th International Symposium on Power Semiconductor Devices and ICs. ISPSD '96. Proceedings","volume":"28 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1996-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Rapid thermal modeling for smart-power and integrated multichip power circuit design\",\"authors\":\"P. Dupuy, J. Dorkel, P. Tounsi, L. Borucki\",\"doi\":\"10.1109/ISPSD.1996.509474\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"This paper recalls how the two-port network theory can be introduced to solve the 3D heat flow equation in a multilayered plane structure. In this paper we present two pieces of software based on the application of this theory, which are used to analyze the thermal behavior of SmartMos circuits with a fairly good accuracy and short computational times. Finally, an illustration is given and some comparisons are made with experiments and an FE code.\",\"PeriodicalId\":377997,\"journal\":{\"name\":\"8th International Symposium on Power Semiconductor Devices and ICs. ISPSD '96. Proceedings\",\"volume\":\"28 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1996-05-20\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"8th International Symposium on Power Semiconductor Devices and ICs. ISPSD '96. Proceedings\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/ISPSD.1996.509474\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"8th International Symposium on Power Semiconductor Devices and ICs. ISPSD '96. Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISPSD.1996.509474","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 7

摘要

本文回顾了如何引入双端口网络理论来求解多层平面结构中的三维热流方程。在本文中，我们提出了两个基于该理论应用的软件，用于分析SmartMos电路的热行为，具有相当好的精度和较短的计算时间。最后给出了实例，并与实验和有限元程序进行了比较。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文本刊更多论文

Rapid thermal modeling for smart-power and integrated multichip power circuit design

This paper recalls how the two-port network theory can be introduced to solve the 3D heat flow equation in a multilayered plane structure. In this paper we present two pieces of software based on the application of this theory, which are used to analyze the thermal behavior of SmartMos circuits with a fairly good accuracy and short computational times. Finally, an illustration is given and some comparisons are made with experiments and an FE code.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

8th International Symposium on Power Semiconductor Devices and ICs. ISPSD '96. Proceedings

自引率

0.00%

发文量