电子封装热特性自动测试台

2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium Pub Date : 2011-03-20 DOI:10.1109/STHERM.2011.5767200

M. Janicki, Z. Kulesza, T. Torzewicz, A. Napieralski

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引用次数: 18

摘要

本文介绍了一种电子封装热特性专用测量台的设计和实际实现。标准的双冷板(DCP)解决方案通过Peltier热电模块(tem)和张力计桥得到增强。tem由特殊电路自动控制，以提供恒定的外壳温度或恒定的环境热阻。张力计用于确保各层的平行排列，并调节它们之间的接触热阻。在功率二极管的测量过程中，对所实现的支架进行了彻底的测试和验证。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Automated stand for thermal characterization of electronic packages

This paper presents the design and the practical realization of a measurement stand dedicated to thermal characterization of electronic packages. The standard Dual Cold Plate (DCP) solution is enhanced with the Peltier Thermo-Electric Modules (TEMs) and a tensometer bridge. The TEMs are automatically controlled by a special circuit so as to provide either constant case temperature or constant thermal resistance to ambient. The tensometers are used to assure parallel alignment of the layers and to adjust contact thermal resistance between them. The realized stand is thoroughly tested and verified during the measurements of a power diode.

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2011 27th Annual IEEE Semiconductor Thermal Measurement and Management Symposium

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