使用架构模拟器了解晶圆级GPU性能

C. Thames, Hang Yan, Yifan Sun
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引用次数: 0

摘要

晶圆级芯片有可能打破芯片尺寸的限制,并提供极端的性能可扩展性。现有的解决方案已经证明了在晶圆上大规模集成多cpu和多gpu系统的可能性。这种增强的功能导致管理内存和计算资源的复杂性增加。为了支持业界对晶圆级系统的研究,本文开发了一个架构模拟器,专门用于对晶圆级多器件系统进行建模。此外,这项工作展示了对晶圆级GPU系统模拟的初始结果的分析,为指导未来的系统设计提供了有用的见解。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Understanding wafer-scale GPU performance using an architectural simulator
Wafer-Scale chips have the potential to break the die-size limitation and provide extreme performance scalability. Existing solutions have demonstrated the possibility of integrating multi-CPU and multi-GPU systems at a significantly larger scale on a wafer. This increased capability results in an increase in complexity in managing the memory and computing resources. To support the community studying wafer-scale systems, this paper develops an architectural simulator dedicated to modeling wafer-scale multi-device systems. Also, this work demonstrates an analysis of initial results from simulations on wafer-scale GPU systems, providing useful insight that can guide future system design.
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