硅集成电子-光子集成电路

P. Lo, D. Kwong
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摘要

由于其信息延迟和功耗,铜互连不太可能成为支持下一代微处理器不断增长的功能的最终解决方案。利用光互连低能耗和大数据容量的优势,将EPIC汇聚在单芯片平台上实现功能多样化是一种很有前途的方法。在本报告中,我们对这一关键技术的发展现状进行了概述,并为硅微光子学和纳米光子学的集成提供了展望和策略,以满足未来技术节点数据通信的带宽和能量需求。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Silicon integrated electronic-photonic ICs
Copper interconnect is unlikely to be the ultimate solution to support the growing functionalities of next generation microprocessor due to its information latency and power consumption. Converging EPIC on a single chip platform to enable functional diversification emerges as one promising approach to be realized by taking the advantage of low energy and huge data capacity of optical interconnects. In this presentation, we present an overview on the current status of this critical technology development and provide an outlook and strategies for the integration of Si micro- and nano-photonics to meet the bandwidth and energy requirements of data communication in future technology nodes.
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