Ken Chang, Haechang Lee, Ting Wu, K. Kaviani, K. Prabhu, W. Beyene, Norman Chan, Catherine Chen, T. Chin, Alok Gupta, C. Madden, Mahabaleshwara, L. Raghavan, Jie Shen, Xudong Shi
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引用次数: 4
摘要
采用台积电40nm G CMOS工艺,实现了8Gb/s/link功率优化控制器内存接口。它由32条差分数据链路组成,支持32GB/s的有效载荷。请求总线的双峰驱动程序既支持现有XDRTM内存的12位2Gb/s/link单端RSL (Rambus Signaling Level),也支持下一代XDR2TM内存的6位8Gb/s/link差分信令。在此控制器接口上添加了1分接预强调发射器均衡器和带偏移修剪的源退化线性接收器均衡器,以减少信号摆幅,从而最大限度地减少写入和读取方向的功率。测量结果表明,当读操作摆幅为100mV(峰对峰单端),写操作摆幅为150mV时,在实际内存事务的误码率为10-12时,时序裕度大于0.25UI。PHY的实测功率效率为6.5mW/Gb/s。
An 8Gb/s/link, 6.5mW/Gb/s memory interface with bimodal request bus
An 8Gb/s/link power optimized controller memory interface is implemented in TSMC 40nm G CMOS process. It is composed of 32 differential data links to support 32GB/s payload. The bimodal drivers of the request bus enable support of both 12 bits of 2Gb/s/link single-ended RSL (Rambus Signaling Level) for existing XDRTM memory and 6 bits of 8Gb/s/link differential signaling for next generation XDR2TM memory. A 1-tap pre-emphasis transmitter equalizer and a source-degenerated linear receiver equalizer with offset trim are added on this controller interface to reduce signal swing and thus minimize power in both write and read directions. The measurement results show that with a 100mV swing (peak-to-peak single-ended) for the read and a 150mV swing for the write, the timing margin is greater than 0.25UI at a BER of 10-12 with real memory transactions. The measured power efficiency for the PHY is 6.5mW/Gb/s.