130nm CMOS技术中的低漏ESD结构

L. Nagy, A. Chvála, V. Stopjaková
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引用次数: 0

摘要

本文介绍了一种采用通用130纳米CMOS技术开发的非标准ESD保护结构,并用VerilogA语言建模,用于晶体管级电路模拟器。ESD结构代表了片上电路的额外负载,并且在低压和低功耗电路设计中可以显示出相当大的总功耗部分。我们描述并讨论了以最小化泄漏电流为主要设计约束的ESD结构的特性,同时仍然保持其保护能力。本文讨论的另一种ESD结构是为负电压电平设计的,这在电源电压范围和电路设计方面带来了全新的可能性。开发的VerilogA模型的精度与实验室在室温下测量得到的实验数据和铸造厂提供的紧凑模型进行了比较。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Low-Leakage ESD Structures in 130nm CMOS Technology
The paper addresses a non-standard ESD protection structures developed in general purpose 130 nm CMOS technology and modeled in VerilogA language for transistor-level circuit simulators. ESD structures represent an additional load to the on-chip circuits and can exhibit quite significant portion of the overall power consumption in low-voltage and low-power circuit designs. We describe and discuss the properties of ESD structures designed with minimized leakage current as the main design constraint, while still maintaining their protection capabilities. The other ESD structure discussed in this article was designed for negative voltage levels, which brings completely new possibilities in terms of the power supply voltage range and circuit design. The accuracy of developed VerilogA models is compared to experimental data obtained by laboratory measurement at room temperature and compact models provided by the foundry.
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