{"title":"基于积分方程的封装导体和介电体时域耦合电磁电路仿真","authors":"Chuanyi Yang, G. Ouyang, V. Jandhyala","doi":"10.1109/EPEP.2003.1250071","DOIUrl":null,"url":null,"abstract":"A full-wave time domain integral equation formulation for the simulation of finite conductors and dielectrics, linked to linear and non-linear lumped elements, is presented. The method permits coupled rigorous simulation including accounting for EMI and non-linearities in the presence of material effects. In addition, a new quadrature scheme is incorporated for exactly computing temporal delays between every section of finite basis functions defined over triangular patches. This enables finer time step resolution for non-uniform meshes than is permissible with standard Gaussian quadrature and singularity extraction.","PeriodicalId":254477,"journal":{"name":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","volume":"16 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-12-08","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":"{\"title\":\"Integral equation based time domain coupled EM-circuit simulation for packaged conductors and dielectrics\",\"authors\":\"Chuanyi Yang, G. Ouyang, V. Jandhyala\",\"doi\":\"10.1109/EPEP.2003.1250071\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"A full-wave time domain integral equation formulation for the simulation of finite conductors and dielectrics, linked to linear and non-linear lumped elements, is presented. The method permits coupled rigorous simulation including accounting for EMI and non-linearities in the presence of material effects. In addition, a new quadrature scheme is incorporated for exactly computing temporal delays between every section of finite basis functions defined over triangular patches. This enables finer time step resolution for non-uniform meshes than is permissible with standard Gaussian quadrature and singularity extraction.\",\"PeriodicalId\":254477,\"journal\":{\"name\":\"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)\",\"volume\":\"16 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2003-12-08\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"7\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/EPEP.2003.1250071\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Electrical Performance of Electrical Packaging (IEEE Cat. No. 03TH8710)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EPEP.2003.1250071","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Integral equation based time domain coupled EM-circuit simulation for packaged conductors and dielectrics
A full-wave time domain integral equation formulation for the simulation of finite conductors and dielectrics, linked to linear and non-linear lumped elements, is presented. The method permits coupled rigorous simulation including accounting for EMI and non-linearities in the presence of material effects. In addition, a new quadrature scheme is incorporated for exactly computing temporal delays between every section of finite basis functions defined over triangular patches. This enables finer time step resolution for non-uniform meshes than is permissible with standard Gaussian quadrature and singularity extraction.