减少硬盘读写器电阻失效缺陷的工艺改进

Worarat Wilasri, D. Sutivong
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引用次数: 4

摘要

为减少3.5英寸台式硬盘驱动器装配过程中读写磁头故障产生的缺陷,应用FMEA方法对缺陷原因进行了研究和分析。硬盘装配操作的故障率为11.27%。解决方案方法从确定子过程开始,其中PCBA组装过程成为分析的重点,因为它在子过程中呈现最高的故障率。专家们被邀请成为FMEA团队。集思广益、讨论和分析表明,故障的前三大原因是:接触和分离事件在PCBA上产生静电,PCBA材料和包装的变化导致对静电放电的敏感性增加,以及新的设计工艺影响了封头抗静电应力的能力。针对这些原因的两项行动进行了试验。第一个解决方案是实施一种新的工艺,包括防止接触和分离事件,创建受控文件,以及在组装到硬盘驱动器之前对PCBA进行去离子静电放电。第二种解决方案是重新设计磁头,以增强对静电放电流的阻力,提高磁头的性能。实验结果表明,每种溶液分别可将故障率降低至1.67%和5.33%,组合溶液可将故障率降低至1.33%。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Process Improvement to Reduce Defects from Magnetic Reader Resistance Failure in Hard Disk Drive
This paper illustrates an application of the FMEA method to study and analyze the defect causes in order to reduce the defects from failure of the magnetic reader head used in the 3.5-inch desktop hard disk drive assembly process. The failure ratio of 11.27% was observed at the hard disk drive assembly operation. The solution approach started from identifying sub-processes, where the PCBA Assembly Process became the focus of the analysis since it presented the highest failure ratio among sub-processes. Experts were invited to be the FMEA team. Brainstorming, discussion and analyses indicated that the top three causes of failure arose from: the contact and separation events which induced electrostatic on PCBA, the change of material and packing of PCBA leading to an increase in sensitivity to electrostatic discharge, and the new design process which impacted the head resistance to electrostatic stress. The two actions to address these causes were experimented. The first solution was to implement a new process incorporating the prevention of contact and separation events, creating controlled document, and deionizing electrostatic discharge on PCBA before assembling to the hard disk drive. The second solution was to redesign magnetic reader head to enhance the resistance on electrostatic discharge flow and to improve head performance. The experimental results showed that each solution could reduce the failure rate to 1.67% and 5.33%, respectively, and the combined solutions could decrease the failure rate to 1.33%.
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