功率GaN HEMT场极板结构优化设计

D. Shuai, G. Weiling, Lei Liang, Lin Tianyu
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引用次数: 1

摘要

氮化镓作为第三代半导体材料具有良好的发展前景。氮化镓的宽带隙使其能够在高温下工作,具有更高的击穿电压和更好的击穿特性。利用仿真软件Silvaco ATLAS对基于AlGaN/GaN的高电子迁移率晶体管(AlGaN/GaN HEMT)的结构进行了仿真分析。首先介绍了场极板结构对击穿电压的影响,然后分析了场极板长度对器件击穿电压的影响。结果表明,场极板长度的变化对击穿电压有较大影响,并通过试验确定了最佳值,对实际器件制作具有实际指导意义。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Optimal design of power GaN HEMT field plate structure
GaN as the third generation semiconductor material has good prospects for development. The wide bandgap of GaN enables it to work at high temperature, and has higher breakdown voltage and better breakdown characteristics. The structure of AlGaN/GaN based high electron mobility transistor (AlGaN/GaN HEMT) is simulated and analyzed by using simulation software Silvaco ATLAS. Firstly, the effect of field plate structure on breakdown voltage is introduced, and then the effect of field plate length on breakdown voltage of devices is analyzed. The results show that the change of field plate length has great influence on breakdown voltage, and the optimal value is determined by testing, which has practical guiding significance for the actual device fabrication.
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