比较3D物联网上的路由协议

Proceedings of the Eighteenth ACM International Symposium on Mobile Ad Hoc Networking and Computing Pub Date : 2018-06-26 DOI:10.1145/3209582.3225199

Armir Bujari, C. Palazzi, D. Ronzani

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引用次数: 2

摘要

很容易预见到未来会有许多智能和连接的东西，静态或移动，占据空间并创建具有3D拓扑结构的物联网(IoT)。不幸的是，最先进的ad-hoc网络路由协议被设计为在2D场景中工作。我们在这里评估这些路由协议如何在3D物联网中执行。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Comparing Routing Protocols over a 3D IoT

It is easy to foresee a future with many smart and connected things, static or moving around, occupying space and creating an Internet of Things (IoT) with a 3D topology. Unfortunately, state-of-the-art routing protocols for ad-hoc networks have been designed to work in 2D scenarios. We here evaluate how these routing protocols would perform in a 3D IoT.

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Proceedings of the Eighteenth ACM International Symposium on Mobile Ad Hoc Networking and Computing

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