新千年的光电封装技术

Conference Proceedings LEOS'96 9th Annual Meeting IEEE Lasers and Electro-Optics Society Pub Date : 1996-11-18 DOI:10.1109/LEOS.1996.571540

A. Janssen

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引用次数: 3

摘要

在可预见的未来，随着光纤网络越来越多地部署，对未来光电元件的性能和成本要求可能会继续。为了满足这些需求，新的材料和制造方法需要从设计为完全密封的组件发展到满足系统可靠性要求，或者需要精确的手动光学校准作为制造过程的一部分。WDM系统和光交换的出现也将需要封装多光纤(带状)组件。

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Packaging technologies for optoelectronics in the new millennium

Performance and cost demands on future optoelectronic components are likely to continue in the foreseeable future as fibre networks are increasingly deployed. To meet these demands, new materials and manufacturing methods need to evolve from components which are designed to be fully hermetic to meet the system reliability requirements or which require precision manual optical alignment as part of the manufacturing process. The advent of WDM systems and optical switching will also require packaging of multi-fibre (ribboned) components.

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Conference Proceedings LEOS'96 9th Annual Meeting IEEE Lasers and Electro-Optics Society

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