亚0.18μm低漏损和高性能动态逻辑宽扇入门

Lidiya Mariam Koshy, J. Chandran
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引用次数: 1

摘要

MOSFET的缩放影响超大规模集成电路的漏损和延迟。此外,闸内宽扇的实现增加了泄漏和延迟。本文给出了在宽扇入门中实现的各种多米诺骨牌逻辑的功耗和时延的比较分析。分析了电源电压、温度、信号强度等因素的变化对延迟的影响。本文考虑了两种类型的延迟:D-Q延迟和C-Q延迟,这将有助于更好地理解不同的动态门,并为设计高性能,低泄漏和规模的VLSI系统做出决策。原理图输入和仿真是使用Mentor Graphics工具包完成的。电路布局已在IC工作站中实现,并在Calibre中运行,采用台积电180nm工艺技术在1.8V下进行物理验证。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Sub- 0.18μm low leakage and high performance dynamic logic wide fan-in gates
MOSFET scaling affects the leakage and delay of VLSI circuits. Moreover implementation of wide fan in gates increases leakage and delay. This paper shows the comparative analysis of power and delay of various domino logic which are implemented in wide fan-in gates. The effect on delay due to the variations in various factors such as supply voltage, temperature and signal strength has been presented. There are two kinds of delay that have been considered: D-Q delay and C-Q delay This will give a better understanding about different dynamic gates and make the decisions for designing high performance, low leakage and sizing of VLSI systems. The schematic entry as well as the simulations were done using Mentor Graphics tool kit. The circuit layout has been implemented in IC workstation and run in Calibre for physical verification using TSMC 180nm process technology at 1.8V.
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