Z. Tian, C. Free, C. Aitchison, P. Barnwell, J. Wood
{"title":"多层厚膜定向耦合器的设计","authors":"Z. Tian, C. Free, C. Aitchison, P. Barnwell, J. Wood","doi":"10.1109/RAWCON.2002.1030167","DOIUrl":null,"url":null,"abstract":"The performance of multilayer directional couplers using a range of different thick-film dielectrics has been investigated. The properties of multilayer coupled lines are examined using their coupled-mode parameters. It is found that the optimum performance of multilayer directional couplers is largely affected by the thick-film dielectric used. A practical design strategy for multilayer directional couplers is developed, which overcomes the problem of excessive computation that is normally associated with the optimization of multilayer circuit designs. The methodology has been verified through the design and measurement of wide bandwidth 2 dB and 3 dB directional couplers that were fabricated using multilayer thick-film technology.","PeriodicalId":132092,"journal":{"name":"Proceedings RAWCON 2002. 2002 IEEE Radio and Wireless Conference (Cat. No.02EX573)","volume":"145 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-11-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":"{\"title\":\"Design of directional couplers using multilayer thick-film technology\",\"authors\":\"Z. Tian, C. Free, C. Aitchison, P. Barnwell, J. Wood\",\"doi\":\"10.1109/RAWCON.2002.1030167\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"The performance of multilayer directional couplers using a range of different thick-film dielectrics has been investigated. The properties of multilayer coupled lines are examined using their coupled-mode parameters. It is found that the optimum performance of multilayer directional couplers is largely affected by the thick-film dielectric used. A practical design strategy for multilayer directional couplers is developed, which overcomes the problem of excessive computation that is normally associated with the optimization of multilayer circuit designs. The methodology has been verified through the design and measurement of wide bandwidth 2 dB and 3 dB directional couplers that were fabricated using multilayer thick-film technology.\",\"PeriodicalId\":132092,\"journal\":{\"name\":\"Proceedings RAWCON 2002. 2002 IEEE Radio and Wireless Conference (Cat. No.02EX573)\",\"volume\":\"145 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-11-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"4\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings RAWCON 2002. 2002 IEEE Radio and Wireless Conference (Cat. No.02EX573)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/RAWCON.2002.1030167\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings RAWCON 2002. 2002 IEEE Radio and Wireless Conference (Cat. No.02EX573)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/RAWCON.2002.1030167","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Design of directional couplers using multilayer thick-film technology
The performance of multilayer directional couplers using a range of different thick-film dielectrics has been investigated. The properties of multilayer coupled lines are examined using their coupled-mode parameters. It is found that the optimum performance of multilayer directional couplers is largely affected by the thick-film dielectric used. A practical design strategy for multilayer directional couplers is developed, which overcomes the problem of excessive computation that is normally associated with the optimization of multilayer circuit designs. The methodology has been verified through the design and measurement of wide bandwidth 2 dB and 3 dB directional couplers that were fabricated using multilayer thick-film technology.