烧结银的工艺-结构-性能相关性

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Pub Date : 2016-05-01 DOI:10.1109/ITHERM.2016.7517665

M. A. Ras, D. May, J. Heilmann, S. Rzepka, B. Michel, B. Wunderle

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引用次数: 3

摘要

本文对烧结银进行了系统的研究。为了研究工艺条件、显微组织、热学和电学性能之间的关系，在烧结温度为200℃~ 270℃，烧结压力为5 MPa ~ 25 MPa的27种变化条件下制备了烧结银样品。对于热学和电学特性，采用了创新的LaTIMA测试台。用聚焦离子束(FIB)和扫描电子显微镜(SEM)对样品的微观结构进行了分析。热学、电学表征和结构分析结果表明，烧结银的工艺条件与烧结银有明显的相关性。

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Processing-structure-property correlations of sintered silver

This paper presents a systematic study of sintered silver. In order to investigate the correlation between processing conditions, microstructures, thermal and electrical properties, sintered silver samples have been prepared in 27 variations of sintering temperature between 200°C and 270°C and sintering pressure between 5 MPa and 25 MPa. For the thermal and electrical characterization, the innovative test stand LaTIMA has been used. The microstructures of the samples have been analyzed by focused ion beam (FIB) and scanning electron microscope (SEM). The results of the thermal and electrical characterizations as well as the structure analysis showed clear correlation to the process conditions of sintered silver.

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2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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