Changbeom Woo, Shinkeun Kim, Jaeyeol Park, Hyungcheol Shin
{"title":"器件缩放对V-NAND中电子横向迁移机制的影响","authors":"Changbeom Woo, Shinkeun Kim, Jaeyeol Park, Hyungcheol Shin","doi":"10.23919/SNW.2019.8782947","DOIUrl":null,"url":null,"abstract":"In this paper, we analyzed lateral migration (LM) mechanism of V-NAND occurring during retention operation depending on scaling of geometric parameters using TCAD simulation. Modeling for LM was performed and the behavior of time-constant (τ) parameter used for modeling was analyzed. In addition, we analyzed retention characteristics according to the states of neighbor word line (WLNei.). Comparing the extracted τ for different patterns, checker-board pattern (C/P) has the smallest τ, followed by NPN and solid pattern (S/P).","PeriodicalId":170513,"journal":{"name":"2019 Silicon Nanoelectronics Workshop (SNW)","volume":"125 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-06-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":"{\"title\":\"Effect of Device Scaling on Lateral Migration Mechanism of Electrons in V-NAND\",\"authors\":\"Changbeom Woo, Shinkeun Kim, Jaeyeol Park, Hyungcheol Shin\",\"doi\":\"10.23919/SNW.2019.8782947\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, we analyzed lateral migration (LM) mechanism of V-NAND occurring during retention operation depending on scaling of geometric parameters using TCAD simulation. Modeling for LM was performed and the behavior of time-constant (τ) parameter used for modeling was analyzed. In addition, we analyzed retention characteristics according to the states of neighbor word line (WLNei.). Comparing the extracted τ for different patterns, checker-board pattern (C/P) has the smallest τ, followed by NPN and solid pattern (S/P).\",\"PeriodicalId\":170513,\"journal\":{\"name\":\"2019 Silicon Nanoelectronics Workshop (SNW)\",\"volume\":\"125 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-06-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"3\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 Silicon Nanoelectronics Workshop (SNW)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.23919/SNW.2019.8782947\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 Silicon Nanoelectronics Workshop (SNW)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/SNW.2019.8782947","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Effect of Device Scaling on Lateral Migration Mechanism of Electrons in V-NAND
In this paper, we analyzed lateral migration (LM) mechanism of V-NAND occurring during retention operation depending on scaling of geometric parameters using TCAD simulation. Modeling for LM was performed and the behavior of time-constant (τ) parameter used for modeling was analyzed. In addition, we analyzed retention characteristics according to the states of neighbor word line (WLNei.). Comparing the extracted τ for different patterns, checker-board pattern (C/P) has the smallest τ, followed by NPN and solid pattern (S/P).