用于航空航天工业的先进微电子产品

E. Jackson, A. Jackson
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引用次数: 1

摘要

作者报告了目前和计划用于航空航天工业的微电子产品的研究结果。我们联系了美国和日本的主要电子制造商,并对参与研究的每家公司的主要人员进行了深入访谈。1987年下半年,对日本公司进行了为期三个月的研究。航空航天工程师主要关心的一个研究问题是快速变化的电子工业如何满足他们的需求。研究的重点是先进的微电子产品。重点是高可靠性和扩展温度范围的部件,以及全军用规格和辐射硬化部件。结果表明,为了满足航空航天工业的需求,美国和日本的微电子公司正在做大量的工作。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Advanced microelectronic products for the aerospace industry
The authors report the results of a study of present and planned microelectronic products intended for the aerospace industry. Major US and Japanese electronics manufacturers were contacted and in-depth interviews were conducted with key personnel from each firm included in the study. A study of the Japanese firms was done in Japan over a three month period during the second half of 1987. A question in the study of primary concern to aerospace engineers is of how the rapidly changing electronic industry is approaching their needs. Emphasis in the study was on advanced microelectronic products. Attention was focused on high-reliability and extended-temperature-range parts, as well as full military specification and radiation-hardened parts. The results indicate that a great deal of work is being done by both US and Japanese microelectronic firms to meet the needs of the aerospace industry.<>
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