气体传感用超低功耗热板的研制

I. Elmi, S. Zampolli, E. Cozzani, M. Passini, G. Cardinali, M. Severi
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引用次数: 25

摘要

本文讨论了用于金属氧化物气体传感器基板的超低功耗(ULP)消耗热板的发展。几种不同形状和尺寸的ULP器件已经用相同的前侧体硅微加工技术制造出来。提供了有关器件设计和制造工艺的详细信息。对ULP热板的功能行为进行了深入的研究。报告了热板温度与施加功率的典型测量结果。在400°c时,可以突出显示一个非常令人满意的8.9 mW值。进行了瞬态温度响应和热板热时间常数的计算。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Development of Ultra Low Power Consumption Hotplates for Gas Sensing Applications
This paper deals with the development of state-of-the-art ultra low power (ULP) consumption hotplates to be used as metal oxide gas sensor substrates. Several types of ULP devices, differing in shape and size, have been fabricated with the same front-side bulk silicon micromachining technology. Details on the device design and on the fabrication processes are provided. The ULP hotplates functional behavior was thoroughly investigated. Typical results on measurements of the hotplate temperature versus applied power are reported. A very satisfactory value of 8.9 mW at 400degC can be highlighted. Transient temperature responses and evaluation of the hotplate thermal time constant were also carried out.
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