VLSI可靠性工程的发展

D. Crook
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引用次数: 80

摘要

预测表明,到本世纪初,微型计算机芯片将有1亿个晶体管,故障率将低于10 FIT。目前正在开发的传统加速产品寿命测试和晶圆级可靠性测量技术在解决复杂VLSI电路的10 FIT故障率方面存在严重局限性。讨论了这些限制,以及可靠性工程和制造社区在未来十年必须采取的方向变化,以应对不断降低故障率目标的挑战。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Evolution of VLSI reliability engineering
Projection indicates that by the turn of the century microcomputer chips will have 100 million transistors and failure rates of less than 10 FIT. Traditional accelerated product life tests and wafer-level reliability measurement techniques presently being developed will have severe limitations in resolving the 10 FIT failure rate of complex VLSI circuits. These limitations are discussed, along with the change in direction that the reliability engineering and manufacturing community will have to take over the next decade to meet the challenge of continuously decreasing failure rate goals.<>
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