Qinghao Zhang, Ruoyi Xie, F. Guo, Shashwat Sharma, Damian Marek, P. Triverio
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An Efficient Methodology to Parse and Mesh Large Interconnect Layouts for Electromagnetic Analysis
We present a complete methodology to import and mesh the layout of complex interconnect networks for electromag-netic analysis. At first glance, these tasks may seem straightfor-ward. In reality, they require complex geometrical operations, which are not trivial to perform efficiently and robustly for realistic layouts. The methodology is based on publicly-available libraries and generates a conformal surface mesh suitable for the boundary element method. The method is tested on an entire IC package from the Packaging Benchmark Suite.