{"title":"搬运机器人可靠性评估技术的发展","authors":"B. Sung, Jong-Bae Lee","doi":"10.1080/22348972.2018.1515693","DOIUrl":null,"url":null,"abstract":"ABSTRACTSince the semiconductor manufacturing process requires high precision, performance deterioration is largely confirmed even by microscopic impact or impurities. However, it is difficult to m...","PeriodicalId":150994,"journal":{"name":"Journal of International Council on Electrical Engineering","volume":"98 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2018-10-09","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Development of reliability assessment technique forwafer transfer robot\",\"authors\":\"B. Sung, Jong-Bae Lee\",\"doi\":\"10.1080/22348972.2018.1515693\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"ABSTRACTSince the semiconductor manufacturing process requires high precision, performance deterioration is largely confirmed even by microscopic impact or impurities. However, it is difficult to m...\",\"PeriodicalId\":150994,\"journal\":{\"name\":\"Journal of International Council on Electrical Engineering\",\"volume\":\"98 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2018-10-09\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Journal of International Council on Electrical Engineering\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1080/22348972.2018.1515693\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Journal of International Council on Electrical Engineering","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1080/22348972.2018.1515693","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Development of reliability assessment technique forwafer transfer robot
ABSTRACTSince the semiconductor manufacturing process requires high precision, performance deterioration is largely confirmed even by microscopic impact or impurities. However, it is difficult to m...