Wei Huang, M. Stan, K. Skadron, K. Sankaranarayanan, S. Ghosh, S. Velusamy
{"title":"紧凑的热建模温度敏感的设计","authors":"Wei Huang, M. Stan, K. Skadron, K. Sankaranarayanan, S. Ghosh, S. Velusamy","doi":"10.1145/996566.996800","DOIUrl":null,"url":null,"abstract":"Thermal design in sub-100nm technologies is one of the major challenges to the CAD community. In this paper, we first introduce the idea of temperature-aware design. We then propose a compact thermal model which can be integrated with modern CAD tools to achieve a temperature-aware design methodology. Finally, we use the compact thermal model in a case study of microprocessor design to show the importance of using temperature as a guideline for the design. Results from our thermal model show that a temperature-aware design approach can provide more accurate estimations, and therefore better decisions and faster design convergence.","PeriodicalId":115059,"journal":{"name":"Proceedings. 41st Design Automation Conference, 2004.","volume":"236 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2004-06-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"348","resultStr":"{\"title\":\"Compact thermal modeling for temperature-aware design\",\"authors\":\"Wei Huang, M. Stan, K. Skadron, K. Sankaranarayanan, S. Ghosh, S. Velusamy\",\"doi\":\"10.1145/996566.996800\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Thermal design in sub-100nm technologies is one of the major challenges to the CAD community. In this paper, we first introduce the idea of temperature-aware design. We then propose a compact thermal model which can be integrated with modern CAD tools to achieve a temperature-aware design methodology. Finally, we use the compact thermal model in a case study of microprocessor design to show the importance of using temperature as a guideline for the design. Results from our thermal model show that a temperature-aware design approach can provide more accurate estimations, and therefore better decisions and faster design convergence.\",\"PeriodicalId\":115059,\"journal\":{\"name\":\"Proceedings. 41st Design Automation Conference, 2004.\",\"volume\":\"236 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2004-06-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"348\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"Proceedings. 41st Design Automation Conference, 2004.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1145/996566.996800\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings. 41st Design Automation Conference, 2004.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/996566.996800","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Compact thermal modeling for temperature-aware design
Thermal design in sub-100nm technologies is one of the major challenges to the CAD community. In this paper, we first introduce the idea of temperature-aware design. We then propose a compact thermal model which can be integrated with modern CAD tools to achieve a temperature-aware design methodology. Finally, we use the compact thermal model in a case study of microprocessor design to show the importance of using temperature as a guideline for the design. Results from our thermal model show that a temperature-aware design approach can provide more accurate estimations, and therefore better decisions and faster design convergence.