紧凑的热建模温度敏感的设计

Wei Huang, M. Stan, K. Skadron, K. Sankaranarayanan, S. Ghosh, S. Velusamy
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引用次数: 348

摘要

亚100nm技术的热设计是CAD社区面临的主要挑战之一。本文首先介绍了温度感知设计的思想。然后,我们提出了一个紧凑的热模型,可以与现代CAD工具集成,以实现温度感知设计方法。最后,我们在微处理器设计的案例研究中使用了紧凑的热模型,以显示使用温度作为设计指南的重要性。我们的热模型结果表明,温度感知设计方法可以提供更准确的估计,从而更好的决策和更快的设计收敛。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Compact thermal modeling for temperature-aware design
Thermal design in sub-100nm technologies is one of the major challenges to the CAD community. In this paper, we first introduce the idea of temperature-aware design. We then propose a compact thermal model which can be integrated with modern CAD tools to achieve a temperature-aware design methodology. Finally, we use the compact thermal model in a case study of microprocessor design to show the importance of using temperature as a guideline for the design. Results from our thermal model show that a temperature-aware design approach can provide more accurate estimations, and therefore better decisions and faster design convergence.
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