G. Yeap, J. Chen, P. Grudowski, Y. Jeon, Y. Shiho, W. Qi, S. Jallepalli, N. Ramani, K. Hellig, L. Vishnubhotla, T. Luo, H. Tseng, Y. Du, S. Lim, P. Abramowitz, C. Reddy, S. Parihar, R. Singh, M. Wright, K. Patterson, N. Benavides, D. Bonser, T. V. Gompel, J. Conner, J.J. Lee, M. Rendon, D. Hall, A. Nghiem, R. Stout, K. Weidemann, A. Duvallet, J. Alvis, D. Dyer, D. Burnett, P. Ingersoll, K. Wimmer, S. Veeraraghavan, M. Foisy, M. Hall, J. Pellerin, D. Wristers, M. Woo, C. Lage
{"title":"一种100nm铜/低k块CMOS技术，具有多Vt和多栅极氧化物集成晶体管，适用于低待机功耗，高性能和芯片上RF/模拟系统应用","authors":"G. Yeap, J. Chen, P. Grudowski, Y. Jeon, Y. Shiho, W. Qi, S. Jallepalli, N. Ramani, K. Hellig, L. Vishnubhotla, T. Luo, H. Tseng, Y. Du, S. Lim, P. Abramowitz, C. Reddy, S. Parihar, R. Singh, M. Wright, K. Patterson, N. Benavides, D. Bonser, T. V. Gompel, J. Conner, J.J. Lee, M. Rendon, D. Hall, A. Nghiem, R. Stout, K. Weidemann, A. Duvallet, J. Alvis, D. Dyer, D. Burnett, P. Ingersoll, K. Wimmer, S. Veeraraghavan, M. Foisy, M. Hall, J. Pellerin, D. Wristers, M. Woo, C. Lage","doi":"10.1109/VLSIT.2002.1015370","DOIUrl":null,"url":null,"abstract":"We report a 100 nm modular bulk CMOS technology platform with multi Vt and multi gate oxide integrated transistors that enables device and circuit co-design (M. Fukuma et al., VLSI Tech., 2000) techniques (e.g. well biasing and power down/reduction) for low standby power (LSP), high performance (HP), high speed (HS), and RF/analog system on chip (SoC) applications. The transistor performances are comparable to or better than recently reported data at the 100 nm technology node. This technology also features an all-layer copper/low-k (<3.0) interlayer dielectric (ILD) backend for speed improvement and dynamic power reduction (S. Parihar et al., Proc. IEDM, 2001).","PeriodicalId":103040,"journal":{"name":"2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303)","volume":"76 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2002-06-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"20","resultStr":"{\"title\":\"A 100 nm copper/low-k bulk CMOS technology with multi Vt and multi gate oxide integrated transistors for low standby power, high performance and RF/analog system on chip applications\",\"authors\":\"G. Yeap, J. Chen, P. Grudowski, Y. Jeon, Y. Shiho, W. Qi, S. Jallepalli, N. Ramani, K. Hellig, L. Vishnubhotla, T. Luo, H. Tseng, Y. Du, S. Lim, P. Abramowitz, C. Reddy, S. Parihar, R. Singh, M. Wright, K. Patterson, N. Benavides, D. Bonser, T. V. Gompel, J. Conner, J.J. Lee, M. Rendon, D. Hall, A. Nghiem, R. Stout, K. Weidemann, A. Duvallet, J. Alvis, D. Dyer, D. Burnett, P. Ingersoll, K. Wimmer, S. Veeraraghavan, M. Foisy, M. Hall, J. Pellerin, D. Wristers, M. Woo, C. Lage\",\"doi\":\"10.1109/VLSIT.2002.1015370\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"We report a 100 nm modular bulk CMOS technology platform with multi Vt and multi gate oxide integrated transistors that enables device and circuit co-design (M. Fukuma et al., VLSI Tech., 2000) techniques (e.g. well biasing and power down/reduction) for low standby power (LSP), high performance (HP), high speed (HS), and RF/analog system on chip (SoC) applications. The transistor performances are comparable to or better than recently reported data at the 100 nm technology node. This technology also features an all-layer copper/low-k (<3.0) interlayer dielectric (ILD) backend for speed improvement and dynamic power reduction (S. Parihar et al., Proc. IEDM, 2001).\",\"PeriodicalId\":103040,\"journal\":{\"name\":\"2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303)\",\"volume\":\"76 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-06-11\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"20\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/VLSIT.2002.1015370\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2002 Symposium on VLSI Technology. Digest of Technical Papers (Cat. No.01CH37303)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VLSIT.2002.1015370","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
A 100 nm copper/low-k bulk CMOS technology with multi Vt and multi gate oxide integrated transistors for low standby power, high performance and RF/analog system on chip applications
We report a 100 nm modular bulk CMOS technology platform with multi Vt and multi gate oxide integrated transistors that enables device and circuit co-design (M. Fukuma et al., VLSI Tech., 2000) techniques (e.g. well biasing and power down/reduction) for low standby power (LSP), high performance (HP), high speed (HS), and RF/analog system on chip (SoC) applications. The transistor performances are comparable to or better than recently reported data at the 100 nm technology node. This technology also features an all-layer copper/low-k (<3.0) interlayer dielectric (ILD) backend for speed improvement and dynamic power reduction (S. Parihar et al., Proc. IEDM, 2001).
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