基于几种半导体作为衬底的三栅极FinFET分析的阈值电压滚降

A. Aditya, S. Basu, Saurav Khandelwal, Saradindu Panda, Chiradeep Mukherjee, B. Maji
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引用次数: 2

摘要

功率器件的文献必须意识到在半导体材料的选择和相应的氧化物之间进行适当的权衡。随着半导体技术的发展,传统的半导体有了碳化硅、氮化镓等有前途的竞争对手。仿真考虑了测量阈值电压滚降的FinFET通道中心平面最小电位的计算。分析证明氮化镓和碳化硅是FinFET制造行业最有前途的材料。在保持其他参数不变的情况下,漏源电压随翅片高度、翅片厚度和通道长度的变化而变化。本工作的目的是找出固态器件技术中“硅以外”的材料。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Threshold voltage roll-off for triple gate FinFET analysis based on several semiconductors used as substrate
The literature of power device must aware of the fact of proper tradeoff between the choice of semiconductor material and the proper oxide along with it. With the growing semiconductor technology, the traditional semiconductor now has the promising competitors like silicon carbide and gallium nitride.The simulation considers the calculation of minimum potential at the center plane of the FinFET channel through which roll-off of threshold voltage is measured. The analysis proves gallium nitride and silicon carbide as the most promising material for FinFET manufacturing industries. The drain to source voltage along with fin-height, fin thickness and channel length are varied keeping other parameters constant. The purpose of this work is to find out the “other than silicon” material in solid state device technology.
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