蓝宝石上硅(SOS)双极晶体管:纳秒热处理的影响

S. D. Russell, B. Offord, K. Weiner
{"title":"蓝宝石上硅(SOS)双极晶体管:纳秒热处理的影响","authors":"S. D. Russell, B. Offord, K. Weiner","doi":"10.1109/SOSSOI.1990.145736","DOIUrl":null,"url":null,"abstract":"Nanosecond thermal processing (NTP) using a XeCl excimer laser was employed in the fabrication of npn bipolar transistors in silicon-on-sapphire (SOS). Functional devices, with current gain approach 100, were obtained. The deleterious effects of diffusion pipes in SOS material were minimized using rapid laser activation of ion implanted dopant. Devices were fabricated using n-type epitaxially deposited silicon on double-solid-phase-epitaxy (DSPE) improved SOS. The total thickness of the first and second silicon epi-layers was nominally 2.0 mu m. Devices were fabricated using three different laser fluences for the emitter anneal. This corresponds to a variation in melt duration and corresponding metallurgical junction depth.<<ETX>>","PeriodicalId":344373,"journal":{"name":"1990 IEEE SOS/SOI Technology Conference. Proceedings","volume":"136 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-10-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Bipolar transistors in silicon-on-sapphire (SOS): effects of nanosecond thermal processing\",\"authors\":\"S. D. Russell, B. Offord, K. Weiner\",\"doi\":\"10.1109/SOSSOI.1990.145736\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Nanosecond thermal processing (NTP) using a XeCl excimer laser was employed in the fabrication of npn bipolar transistors in silicon-on-sapphire (SOS). Functional devices, with current gain approach 100, were obtained. The deleterious effects of diffusion pipes in SOS material were minimized using rapid laser activation of ion implanted dopant. Devices were fabricated using n-type epitaxially deposited silicon on double-solid-phase-epitaxy (DSPE) improved SOS. The total thickness of the first and second silicon epi-layers was nominally 2.0 mu m. Devices were fabricated using three different laser fluences for the emitter anneal. This corresponds to a variation in melt duration and corresponding metallurgical junction depth.<<ETX>>\",\"PeriodicalId\":344373,\"journal\":{\"name\":\"1990 IEEE SOS/SOI Technology Conference. Proceedings\",\"volume\":\"136 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"1990-10-02\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"1990 IEEE SOS/SOI Technology Conference. Proceedings\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/SOSSOI.1990.145736\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"1990 IEEE SOS/SOI Technology Conference. Proceedings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/SOSSOI.1990.145736","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

摘要

利用XeCl准分子激光进行纳秒热处理(NTP),制备了蓝宝石上硅(SOS)的npn双极晶体管。获得了电流增益接近100的功能器件。采用快速激光激活离子注入掺杂剂的方法,减小了SOS材料中扩散管的有害影响。采用n型外延沉积硅在双固相外延(DSPE)改进的SOS上制备器件。第一层和第二层硅外延层的总厚度名义上为2.0 μ m。器件使用三种不同的激光影响进行发射器退火。这对应于熔体持续时间和相应的冶金结深度的变化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Bipolar transistors in silicon-on-sapphire (SOS): effects of nanosecond thermal processing
Nanosecond thermal processing (NTP) using a XeCl excimer laser was employed in the fabrication of npn bipolar transistors in silicon-on-sapphire (SOS). Functional devices, with current gain approach 100, were obtained. The deleterious effects of diffusion pipes in SOS material were minimized using rapid laser activation of ion implanted dopant. Devices were fabricated using n-type epitaxially deposited silicon on double-solid-phase-epitaxy (DSPE) improved SOS. The total thickness of the first and second silicon epi-layers was nominally 2.0 mu m. Devices were fabricated using three different laser fluences for the emitter anneal. This corresponds to a variation in melt duration and corresponding metallurgical junction depth.<>
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