功率控制型蓝牙CMOS Class1功率放大器的设计

A. El-Sabban, H. Ragai
{"title":"功率控制型蓝牙CMOS Class1功率放大器的设计","authors":"A. El-Sabban, H. Ragai","doi":"10.1080/00207210701828010","DOIUrl":null,"url":null,"abstract":"In this paper, an RF power amplifier intended for Class 1 Bluetooth application is designed using 0.35mum CMOS technology. A layout-aware macromodel for the BSIM3v3 MOSFET transistor for RF applications including substrate effect is investigated and used in this design. The model is validated for a 0.35mum CMOS process using a transistor with total width of 90mum and 18 fingers and it shows an excellent agreement with the ft, and S-parameter measurement data up to 6GHz. Effect of pads and bond wires are also taken into consideration during the design process of the PA. After post-layout simulations, the amplifier delivers an output power of 19dBm with 33.7% PAE under 3.3V supply. This amplifier has a power control feature. Its two stage circuit utilizes a cascode configuration in its first stage in order to use its bias pin as a power control input for the amplifier. Using this method, the power control range can be decreased down to 1.4 dBm which satisfies the Bluetooth standard. The chip is fabricated and is currently under testing","PeriodicalId":399250,"journal":{"name":"International Conference on Design and Test of Integrated Systems in Nanoscale Technology, 2006. DTIS 2006.","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-10-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":"{\"title\":\"Design of power-controlled Class1 Bluetooth CMOS power amplifier\",\"authors\":\"A. El-Sabban, H. Ragai\",\"doi\":\"10.1080/00207210701828010\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper, an RF power amplifier intended for Class 1 Bluetooth application is designed using 0.35mum CMOS technology. A layout-aware macromodel for the BSIM3v3 MOSFET transistor for RF applications including substrate effect is investigated and used in this design. The model is validated for a 0.35mum CMOS process using a transistor with total width of 90mum and 18 fingers and it shows an excellent agreement with the ft, and S-parameter measurement data up to 6GHz. Effect of pads and bond wires are also taken into consideration during the design process of the PA. After post-layout simulations, the amplifier delivers an output power of 19dBm with 33.7% PAE under 3.3V supply. This amplifier has a power control feature. Its two stage circuit utilizes a cascode configuration in its first stage in order to use its bias pin as a power control input for the amplifier. Using this method, the power control range can be decreased down to 1.4 dBm which satisfies the Bluetooth standard. The chip is fabricated and is currently under testing\",\"PeriodicalId\":399250,\"journal\":{\"name\":\"International Conference on Design and Test of Integrated Systems in Nanoscale Technology, 2006. DTIS 2006.\",\"volume\":\"18 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2006-10-16\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"2\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"International Conference on Design and Test of Integrated Systems in Nanoscale Technology, 2006. DTIS 2006.\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1080/00207210701828010\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Conference on Design and Test of Integrated Systems in Nanoscale Technology, 2006. DTIS 2006.","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1080/00207210701828010","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2

摘要

本文采用0.35 μ m CMOS技术,设计了一种适用于1类蓝牙应用的射频功率放大器。本文研究了一种用于射频应用的BSIM3v3 MOSFET晶体管的布局感知宏模型,并将其应用于本设计中。该模型在0.35 μ m CMOS工艺中使用总宽度为90μ m、18指的晶体管进行了验证,结果表明该模型与高达6GHz的ft和s参数测量数据具有良好的一致性。在设计过程中还考虑了焊盘和焊线的影响。经过布局后仿真,该放大器在3.3V电源下的输出功率为19dBm, PAE为33.7%。这个放大器有功率控制功能。其两级电路在其第一级采用级联码配置,以便将其偏置引脚用作放大器的功率控制输入。使用该方法,可以将功率控制范围减小到1.4 dBm,满足蓝牙标准。该芯片已制成,目前正在测试中
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Design of power-controlled Class1 Bluetooth CMOS power amplifier
In this paper, an RF power amplifier intended for Class 1 Bluetooth application is designed using 0.35mum CMOS technology. A layout-aware macromodel for the BSIM3v3 MOSFET transistor for RF applications including substrate effect is investigated and used in this design. The model is validated for a 0.35mum CMOS process using a transistor with total width of 90mum and 18 fingers and it shows an excellent agreement with the ft, and S-parameter measurement data up to 6GHz. Effect of pads and bond wires are also taken into consideration during the design process of the PA. After post-layout simulations, the amplifier delivers an output power of 19dBm with 33.7% PAE under 3.3V supply. This amplifier has a power control feature. Its two stage circuit utilizes a cascode configuration in its first stage in order to use its bias pin as a power control input for the amplifier. Using this method, the power control range can be decreased down to 1.4 dBm which satisfies the Bluetooth standard. The chip is fabricated and is currently under testing
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