IDDQ传感器技术综述

S. Roy, A. Kornfeld
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引用次数: 1

摘要

通常对于CMOS器件,只有当器件状态从off-to-on或on-to-off切换时才消耗电流和功率。诸如栅-氧化物短路、层间桥、漏pn结或针孔缺陷等缺陷机制可导致在电路运行的非过渡部分测量到的电流状态升高。在正常静止工作时间内,对电源(VDD)或地(GND)总线中这些异常大的电源电流(IDDQ)的检测允许检测这些物理缺陷机制,这些物理缺陷机制在使用简单的故障卡住测试时通常不会被考虑在内。本文概述了IDDQ传感器技术,并提出了一种改进的片上IDDQ电流传感器,该传感器将测试应用时间从1mhz增加到8mhz。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
An Overview of IDDQ Sensor Techniques
Normally for CMOS devices, current and power is consumed only when a device switches state from off-to-on or on-to-off. Defect mechanisms such as gate-oxide shorts, bridges between layers, leaky p-n junctions, or pin-hole defects can cause elevated current states that can be measured during non-transitional parts of the circuits operation. Detection of these abnormally large supply currents (IDDQ) in the power (VDD) or ground (GND) busses during a normally quiescent operating time allows detection of these physical defect mechanisms which normally are not accounted for when using simple stuck-at-fault testing. This paper presents an overview of IDDQ sensor techniques and presents an improved on-chip IDDQ current sensor which increases test application time from 1 MHz [1] to 8 Mhz.
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