C. Nail, G. Molas, P. Blaise, G. Piccolboni, B. Sklénard, C. Cagli, M. Bernard, A. Roule, M. Azzaz, E. Vianello, C. Carabasse, R. Berthier, D. Cooper, C. Pelissier, T. Magis, G. Ghibaudo, C. Vallée, D. Bedeau, D. Bedau, O. Mosendz, B. De Salvo, L. Perniola
{"title":"使用实验结果和模拟来理解RRAM的续航力、保留率和窗口裕度权衡","authors":"C. Nail, G. Molas, P. Blaise, G. Piccolboni, B. Sklénard, C. Cagli, M. Bernard, A. Roule, M. Azzaz, E. Vianello, C. Carabasse, R. Berthier, D. Cooper, C. Pelissier, T. Magis, G. Ghibaudo, C. Vallée, D. Bedeau, D. Bedau, O. Mosendz, B. De Salvo, L. Perniola","doi":"10.1109/IEDM.2016.7838346","DOIUrl":null,"url":null,"abstract":"In this paper we clarify for the first time the correlation between endurance, window margin and retention of Resistive RAM. To this aim, various classes of RRAM (OXRAM and CBRAM) are investigated, showing high window margin up to 1010 cycles or high 300°C retention. From first principle calculations, we analyze the conducting filament composition for the various RRAM technologies, and extract the key filament features. We then propose an analytical model to calculate the dependence between endurance, window margin and retention, linking material parameters to memory characteristics.","PeriodicalId":186544,"journal":{"name":"2016 IEEE International Electron Devices Meeting (IEDM)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-12-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"75","resultStr":"{\"title\":\"Understanding RRAM endurance, retention and window margin trade-off using experimental results and simulations\",\"authors\":\"C. Nail, G. Molas, P. Blaise, G. Piccolboni, B. Sklénard, C. Cagli, M. Bernard, A. Roule, M. Azzaz, E. Vianello, C. Carabasse, R. Berthier, D. Cooper, C. Pelissier, T. Magis, G. Ghibaudo, C. Vallée, D. Bedeau, D. Bedau, O. Mosendz, B. De Salvo, L. Perniola\",\"doi\":\"10.1109/IEDM.2016.7838346\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"In this paper we clarify for the first time the correlation between endurance, window margin and retention of Resistive RAM. To this aim, various classes of RRAM (OXRAM and CBRAM) are investigated, showing high window margin up to 1010 cycles or high 300°C retention. From first principle calculations, we analyze the conducting filament composition for the various RRAM technologies, and extract the key filament features. We then propose an analytical model to calculate the dependence between endurance, window margin and retention, linking material parameters to memory characteristics.\",\"PeriodicalId\":186544,\"journal\":{\"name\":\"2016 IEEE International Electron Devices Meeting (IEDM)\",\"volume\":\"43 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2016-12-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"75\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2016 IEEE International Electron Devices Meeting (IEDM)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IEDM.2016.7838346\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 IEEE International Electron Devices Meeting (IEDM)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IEDM.2016.7838346","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Understanding RRAM endurance, retention and window margin trade-off using experimental results and simulations
In this paper we clarify for the first time the correlation between endurance, window margin and retention of Resistive RAM. To this aim, various classes of RRAM (OXRAM and CBRAM) are investigated, showing high window margin up to 1010 cycles or high 300°C retention. From first principle calculations, we analyze the conducting filament composition for the various RRAM technologies, and extract the key filament features. We then propose an analytical model to calculate the dependence between endurance, window margin and retention, linking material parameters to memory characteristics.