混合信号体CMOS片上产品设计的范式转变

J. Cheah
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引用次数: 0

摘要

由分立元件组成的无线系统与使用大块CMOS制造的片上系统解决方案之间的成本差异正在缩小。假设工程设计领域的知识已经到位,设计离散和SOC无线通信系统的过程在时间和经济方面正在趋同。是时候考虑用完全集成的硅设计取代传统的PCB和分立器件了。本文讨论了这种范式转变背后的基本原理。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
A paradigm shift in mixed-signal bulk CMOS product-on-chip design
The cost difference between wireless systems made of discrete components and system-on-chip solutions made using bulk CMOS is diminishing. Assuming that engineering design domain knowledge is already in place, the processes of designing both discrete and SOC wireless communications systems are converging in terms of time and economics. The time has come to consider the option of replacing traditional PCB and discrete devices with fully-integrated silicon designs. This paper discusses the rationale behind this paradigm shift.
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