应变锗微桥中的稳态激光作为交叉直接带隙的基本措施

F. A. Armand Pilon, Y. Niquet, J. Chrétien, N. Pauc, V. Reboud, V. Calvo, J. Widiez, J. Hartmann, A. Chelnokov, J. Faist, H. Sigg
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引用次数: 0

摘要

用IV族材料在硅(Si)上实现激光器是半导体行业的夙愿;这将使光子系统以低成本大规模生产成为可能。然而,通往高效光发射器的道路需要具有直接带隙的材料,这与所有典型的III-V族激光器平台一致[1]-[4]。这种结构可以通过与Sn[6]或同时与Sn[7],[8]合金化,使Ge承受拉伸应变[5]来实现。在这里,我们展示了应变锗微桥在低温下的稳态激光,并将这一发现作为Γ和L最小值之间导带排列的基本探针。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Steady state lasing in strained germanium microbridges as fundamental measure for the crossover to direct band gap
The realization of a laser on silicon (Si) from group IV materials is a long-cherished wish of the semiconductor industry; it would enable the mass production of photonic systems at low cost. However, the path towards an efficient light emitter requires material with a direct band gap, in line with all the typical group III-V lasers platforms [1]-[4]. Such configuration can be achieved by loading Ge with tensile strain [5] by alloying with Sn [6] or both [7], [8]. Here, we demonstrate steady state lasing at low temperature in strained germanium microbridges and establish this finding as a fundamental probe for the conduction band line-up between the Γ and L minima.
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