一种基于tsv的交流-直流转换器架构

2013 8th IEEE Design and Test Symposium Pub Date : 2013-12-01 DOI:10.1109/IDT.2013.6727096

K. Salah

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引用次数: 2

摘要

本文提出了一种通过硅孔(TSV)结构来构建交直流变换器。利用三维电磁全波模拟器对该结构进行了分析。结果表明，与2D变压器相比，所提出的3D变换器具有较小的面积和优越的性能，因为在相同的占地面积下，直流变换器的低频范围忽略了损耗衬底效应。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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A TSV-based architecture for AC-DC converters

In this paper, a proposed through silicon via (TSV) structure is used to construct AC-DC converters. This structure is analyzed using 3D electromagnetic full-wave simulators. The results show that the proposed 3D converter exhibits small area with superior performance compared to a 2D transformer, for the same footprint as lossy substrate effects are neglected for low frequency range of interest for DC converters.

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2013 8th IEEE Design and Test Symposium

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