Experimental study on cooling air flow in a thin electronics casing model

This study has been conducted by aiming at acquisition of benchmark test data for CFD simulations for thin electronic equipment. Flow in the model of a thin electronic equipment was measured using a PIV. Dummy components were placed in the model and those configurations were altered. The temperature rise of a heat source in the model was also measured and the cooling performance was examined. PIV measurement results clarified the change of flow depending on the configuration. The comparison of experimental results with numerical results shows a reasonable agreement.