用于高频和低温应用的分析微系统片上元件的电气和布局仿真

A. Druzhinin, Y. Khoverko, V. Dovhij, Iu. Kogut, V. Holota
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引用次数: 0

摘要

本文介绍了“绝缘体上硅”(SOI)结构分析微系统片上部分元件的版图设计和电路拓扑计算机仿真结果。这些元件是:输入级联、运算放大器的基本元件和基于标准体CMOS技术和具有soi结构的CMOS技术的环形振荡器。在较宽的温度范围内对绝缘体上多晶硅电阻元件进行了研究。这些元件可以作为集成电路中模拟和数字信号处理的规则元件矩阵和片上微系统分析信息的初始处理,也可以作为片上微系统智能传感器的敏感元件。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Electrical and layouts simulation of analytical microsystem-on-chip elements for high frequence and low temperature applications
In this paper the results of layout design and circuit-topological computer simulation of some elements of analytical microsytem-on-chip with the “silicon-on-insulator” (SOI)-structures are presented. These elements were: an input cascade, a basic element of operational amplifier and a ring oscillator based on standard bulk CMOS technology and CMOS technology with the SOI-structures. Also the polysilicon-on-insulator resistive elements were studied in the wide temperature range. Such elements can be used as regular elements matrix for analog and digital signal processing in the integrated circuits and initial processing of analytical information microsystem-on-chip or as sensitive elements of the intellectual sensors of microsystem-on-chip.
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