GaAs基微波HBTs的欧姆接触分析

K. Jones, K. Hilton, M. Crouch, B. T. Hughes, M. Cole, W. Han
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引用次数: 0

摘要

只提供摘要形式。我们比较了用于GaAs HBTs的TiPdAu和PdGeTiPt触点的电学、物理和化学性质。用TLM法测量了接触电阻和比接触电阻,比较了用两种不同类型的发射极触点制成的器件,用光学显微镜和扫描电镜检查了表面结构,用俄歇和透射电镜研究了化学结构。此外,还比较了TiPdAu和PdGeTiPt触点与重掺c的GaAs触点之间的关系。用PdGeTiPt触点代替TiPdAu触点的优点是,所有的触点都可以用单一的金属化来制造,并且Pt将成为一个更有效的扩散屏障,以阻止Au的内扩散。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Analyses of ohmic contacts to GaAs based microwave HBTs
Summary form only given. We compare the electrical, physical, and chemical properties of TiPdAu and PdGeTiPt contacts for GaAs HBTs. Contact and specific contact resistances are measured using the TLM method and devices made with the two different types of emitter contacts are compared, the surface structures are examined using optical and scanning electron microscopy, and the chemical structures are investigated with Auger and transmission electron microscopy. In addition, comparisons are made between the TiPdAu and PdGeTiPt contacts to heavily C-doped GaAs. The advantages of being able to substitute PdGeTiPt contacts for TiPdAu are that all of the contacts could be made with a single metallization, and the Pt would be a more effective diffusion barrier to the in-diffusion of Au.
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