单片三维顺序集成在Si CMOS驱动IC上实现1600 ppi红色微型led显示

Juhyuk Park, Dae-Myeong Geum, Woojin Baek, J. Shieh, Sanghyeon Kim
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引用次数: 1

摘要

本工作展示了单片3D (M3D)集成红色微型led显示屏在Si CMOS驱动IC上的应用,我们通过外延层工程和低温工艺设计实现了1600 PPI的高像素密度。M3D顺序集成在预制Si CMOS驱动IC上,允许光刻对齐像素定义,提供高分辨率和每个像素间距的最大发射面积。此外,低温工艺提供了迄今为止报道的最低待机功率的微型led显示器。我们相信这项工作将成为未来超高分辨率显示器的里程碑之一。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
Monolithic 3D sequential integration realizing 1600-PPI red micro-LED display on Si CMOS driver IC
This work demonstrated the monolithic 3D (M3D) integrated red micro-LED display on Si CMOS driver IC. We achieved a very high pixel density of 1600 PPI by epitaxial layer engineering and low-temperature process design for the micro- display application. M3D sequential integration on pre- fabricated Si CMOS driver IC allows lithographic alignment for the pixel definition, providing high-resolution and the largest emission area per pixel pitch. Furthermore, the low-temperature process provided the lowest standby power among ever reported micro-LED displays. We believe that this work would be one of the milestones for future ultra-high-resolution displays.
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